Low thermal expansion, high thermal conductivity, heat sink.
The optimal heat sink requires a balance between thermal expansion rate and conductivity.
Thermal management in device design is an essential fundamental technology for various electronics products where high output and miniaturization are advancing. Ensuring the reliability of devices involves minimizing the thermal impact on semiconductor elements and being mindful of the thermal expansion of each material. When the thermal expansion coefficients of materials differ, significant stress can occur in the materials due to temperature changes, potentially leading to serious malfunctions. At Planzé, we provide ideal heat sinks with high thermal conductivity and appropriate thermal expansion coefficients to enhance device reliability and extend product lifespan.
- 企業：プランゼージャパン
- 価格：Other
